3D InCites in Brief – November 22

Originally posted on 3D InCites’ Francoise in 3D blog


Dear 3D InCites Members,

I think I should call this a “Special Double Issue”, thanks to all the stringers reporting in from various 3D events from around the world that took place in November. I would like to extend my appreciation to Phil Marcoux, reporting from MEPTEC’s Packaging Roadmap Symposium in San Jose, CA; Keith Cooper, of SET NA, reporting from IMAPS International in Raleigh, NC; Paul Werbaneth, of Tegal Corp. reporting on Day 1 at the IEEE 3D IC Symposium in Munich; and Erik Jan Marinissen, of imec, reporting on the 3D Test Workshop in Austin. As for me, I spent a day at SEMATECH in Albany, gathering all kinds of information to share here.

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