At IEEE-3D IC 2009, San Francisco, CA

Paul Werbaneth,Vice President – Marketing and Applications, Tegal Corporation Just back from a week hiking in Yosemite (thank you John Muir!) and in the Bridgeport – Twin Lakes – Matterhorn Peak area (thank you Gary Snyder/ Jack Kerouac and all past-present-future dharma bums).  Bodie, CA, an abandoned gold mining town at the end of the […]

Continue reading →

Thoughts on TSV Technology

Paul Werbaneth, Vice President – Marketing and Applications, Tegal Corporation The ink was almost dry on the TSV etching chapter I am contributing to a project called 3D Technology Platforms when I opened the newspaper today to read about very interesting news from Elpida regarding TSV-stacked DRAM (here:  http://www.i-micronews.com/lectureArticle.asp?id=3448 ). It’s some kind of harmonic […]

Continue reading →