Thoughts on TSV Technology

Paul Werbaneth, Vice President – Marketing and Applications, Tegal Corporation The ink was almost dry on the TSV etching chapter I am contributing to a project called 3D Technology Platforms when I opened the newspaper today to read about very interesting news from Elpida regarding TSV-stacked DRAM (here:  http://www.i-micronews.com/lectureArticle.asp?id=3448 ). It’s some kind of harmonic […]

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